GlobalFoundries to Make Silicon Interposers for TSMC in New York Under Five-Year Deal
Production at the Malta fab is expected to ramp in the first half of 2028, easing a key AI packaging bottleneck.
GlobalFoundries has signed a five-year agreement to manufacture silicon interposers for TSMC at its facility in Malta, New York, Reuters reported Wednesday. Production is expected to ramp in the first half of 2028.
What an interposer does
An interposer is a thin layer of silicon that sits beneath a processor and its stacked high-bandwidth memory, wiring them together with far more connections than a standard circuit board can carry. It is a core ingredient of TSMC's advanced packaging, which is used to assemble most leading AI accelerators.
Packaging capacity, rather than raw chip fabrication, has been one of the tightest constraints on AI hardware supply over the past two years.
A U.S. supply angle
The deal adds U.S.-based capacity to TSMC's packaging chain at a time when chipmakers and their customers are under pressure to diversify production. For GlobalFoundries, which exited the race for leading-edge transistors years ago, it is another sign that specialty and packaging work can be a growth business.
The news landed the same day TSMC reported September revenue up 54.6% from a year earlier.